Industry’s thinnest module uses IPD technology

Plano, Tex. — SyChip has developed the industry’s thinnest — and the company’s first — 802.11g plug-and-play module based on its proprietary integrated passive device (IPD) technology. Developed as a means for miniaturizing mobile handheld devices including smart phones, PDAs, gaming devices and media players, the new module integrates dozens of high Q passive components including baluns, bandpass filters, capacitors, inductors and resistors onto a silicon substrate.