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Fabless Challenges of Integrating Complex Silicon into the IC Package, Even the System PCB

Authored on: Aug 14, 2020

Technical Paper

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This paper defines the key capabilities needed to build a formal, cross-substrate integration flow that enables full collaboration between the IC(s), package, and PCB, and that includes multiple, target, board-level platforms for when devices/components are intended for use on different PCB form factors.

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