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Examples of Physical and Scalable SPICE Models for Modern Power Electronic Devices

Authored on: Aug 1, 2018

Technical Paper

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Efficient power electronic design hinges on the availability of accurate and predictive SPICE models. This paper proposes novel physical and scalable SPICE models for power electronic semiconductors including wide-bandgap devices. The models are based on process and layout parameters, enabling design optimization through a direct link between SPICE, physical design, and process technology. The models are used as key design components during technology development and for the proliferation of new products.

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