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Electrothermal Mechanical Stress Reference Design Flow for Printed Circuit Boards and Electronic Packages

Authored on: Jan 26, 2017 by Manohar Raju

Technical Paper

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This paper presents a reference design flow for solving the electrical, thermal and mechanical challenges of a printed circuit board (PCB) using simulation tools from ANSYS. This approach can be utilized for all electrical CAD (ECAD) types such as IC packages, touch panel displays, and glass and silicon interposers. The authors followed this reference design flow for analyzing a PCB virtual prototype used in the consumer electronics industry.


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