Advanced Cooling and Packaging for Small Form Factor Electronics
Systems are continuing to get smaller and processors more powerful. Typically power consumption increases with system capabilities. As a result, the amount of heat produced and sensitive electronics require adequate cooling to ensure consistent operation. Fanless cooling may be desired for a number of reasons including greater IP protection, the ability to shield sensitive electronics from air contaminants, reduced operating noise, and greater reliability. Unfortunately, the performance of conduction cooling has been limited. Engineers requiring fanless cooling have had two solutions, limit the performance of their boards or opt for expensive liquid cooling or heat pipe solutions.