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Thermal Coupling of On-chip Hot Interconnect for Thermal-aware EM Evaluation

Authored on: Apr 17, 2015 by Stephen Pan

Technical Paper

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Driven by mobile computing and communications, the SoC have been growing very rapidly in silicon integration technology scaling, advanced low power techniques while meeting higher performance requirements using a variety of packaging technologies. The Internet of Things (IoT) is opening up new applications with connected devices and systems, where low power, high performance and reliability are paramount. Since the impact of temperature on power, performance and reliability is huge, accurate thermal analysis is a requirement for the design flow. This paper addresses thermal-aware EM.

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