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Guidelines for Handling Failed Power MOSFETs on PCB Assemblies

Authored on: Jun 15, 2010 by Kandarp Pandya

Technical Paper / Application Note

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When a power MOSFET fails, the challenge is to determine the root cause of failure and implement a containment plan. However, this is more easily said than done. The complexity of semiconductor technologies and the advanced techniques required to analyze them means that failed components must be handled with extreme care in order to retain all possible failure signatures. This application note provides an example with step-by-step instructions for removing a PolarPAK power MOSFET from a PCB.

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