Welcome Guest

Tools for an Optimal Design

Authored on: Sep 6, 2011 by Dave Sommervold

Technical Paper

0
More InfoLess Info

Fabrication of Thermal Clad is similar to traditional FR-4 circuit boards with regard to imaging and wet processing operations. However, secondary mechanical operations are unique, so the consideration of specific design recommendations are critical to ensure the manufacture of reliable, cost-effective T-Clad circuits. This white paper will address design recommendations for circuit image, soldermask, legend and mechanical fabrication. Additional consideration for trace widths, spacing and clearances may be required for electrical integrity based on application voltage.

View
 
Please Login

You will be redirected to the login page

×
Please Login

You will be redirected to the login page

×
Please Login

You will be redirected to the login page