Enhanced interconnect medium simplifies test and verification
In high performance embedded systems test application, the requirement for accurate measurement of AC and DC parameter is often critical. During development phase, IC devices are not permanently attached to the target board. Instead IC devices are connected via interconnect medium to the target board. The spring probe is one of the typical interconnect medium. Spring probes have to be compressed to certain height for making reliable electrical connection. This paper will discuss a new feature added to the spring probe providing electrical resistance within 2-3 milliohms irrespective of the compression height. This enhanced feature allows system developers to test and verify without multiple intervention.