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Thermal Modeling for Application of High Power LED

Authored on: Nov 3, 2006 by Oon Siang Ling

Technical Paper

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This paper presents work done to create a high power LED package on MCPCB with heat sink and double layer FR4 with heat sink. First, a detailed model of an LED package-on-substrate is created, then a heat sink is created on the bottom of the LED package. Finally, this simulation data is compared to experimental data.

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