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Introduction to Via-In-Pad Board Design

Authored on: Jan 8, 2010

Technical Paper / Application Note

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Plated Through-hole Via-In-Pad (VIP) board design is a proven technique that drives forcost competitive board development, improved signal quality, robust yield, and equivalent PCB/Packaging reliability. It is an alternative technique to consider when starting a new board design. This paper will focus on what VIP is and its trade-offs versus other design techniques.

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