Soitec’s engineered substrates to enable 5G
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5G ongoing deployment requires totally new solutions for cellular communication. With the advent of new communication protocols (such as new radio), technologies and products have been developed to meet the more demanding requirements of electronics for 5G base stations, smartphones and other connected devices. In response to energy consumption, reliability and bandwidth capability challenges, as well as performance and integration trade-offs, Soitec has developed current and new generations of engineered substrates such as RF-SOI, FD-SOI, Piezoelectric-On-Insulator (POI) and Epi GaN.
Participants to this interactive webinar will gain an understanding of how the use of new materials allows designers to integrate diverse functions such as switches, power amplifiers and antenna tuners, while providing excellent RF isolation, good insertion loss and better signal integrity at a competitive cost compared to traditional technologies.