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SimScale

SimScale is a cloud-based CAE platform that gives instant access to thermal simulation technology for quick and reliable testing and optimization of electronics designs.

With SimScale, you can investigate temperature distribution and visualize heat flow to develop the best cooling strategy for your device.

Compare active and passive cooling, find the right placement for fans and heat sinks, validate material decisions, and decide on electronics enclosure dimensions with engineering simulation in the web browser.

Headquarters: Munich, Germany
Phone: +49 89 8091327 70
Our Website: https://www.simscale.com/

Industry Aerospace/Defense/Government, Automotive/Transportation, Consumer Electronics & Appliances, Semiconductor Design & Manufacturing
Application & Technologies:
Design Management, Design Tools (EDA), Software/Hardware Development

Our TechOnline Content

Case Study: Improving Thermal Performance of a PCB with Simulation

Tech Paper

SimScale Simulation Feature Overview

Tech Paper

See more from SimScale

Featured Video

SimScale Official Video

SimScale is a cloud-based CAE platform that gives instant access to thermal simulation technology for quick and reliable testing and optimization of electronics designs. […]

Thermal Simulation for Better Electronics Enclosure Design

In this short webinar, we will take a look at how heat transfer or thermal simulation helps FEA engineers or electrical engineers to better anticipate the thermal behavior of an electronics enclosure without the use of complex CFD simulations. […]

Thermal Simulation for Better Electronics Enclosure Design

In this short webinar, we will take a look at how heat transfer or thermal simulation helps FEA engineers or electrical engineers to better anticipate the thermal behavior of an electronics enclosure without the use of complex CFD simulations. […]

Electronic Packaging Cooling with CFD

In this webinar, SimScale’s CEO David Heiny explains how conjugate heat transfer simulation with SimScale can help engineers to better investigate the thermal response of electronic packaging. […]

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