Combining security with advanced process nodes has become a challenge in recent years. This is due to the diminishing alternatives for embedded flash when moving past the 28nm process node. Winbond has introduced the TrustME secure flash products to address this challenge and remove the barriers for adding secure non-volatile storage to practically any process node out there. This webinar will discuss security challenges and Winbond’s unique and proven solutions.

Attendees will:

  • Learn the challenges of using off-chip NVM storage and Winbond’s approach for solving these challenges
  • Become familiar with TrustME certified secure flash products


Nir Tasher, Director of Technology, Winbond

Mr. Nir Tasher serves as Director of Technology for Winbond Security Products and has been with the Winbond group since 2005 serving in various technology related positions. Mr. Tasher has over 25 years of experience in the technology industry. He’s created over 20 US patents in various fields of security and system design. He holds a MSc. EE. Cum Laude from Tel Aviv University.