Free online lecture from EE Times University. Brian Bailey discusses next-generation industrial apps for the connected factory. This five-part series is held online starting at 9am Pacific time for a full week.

Intelligent Embedded Systems for the New Era of Industrial Apps, 5-part class
Monday, November 26 to Friday, November 30, starting at 9am Pacific/Noon Eastern.

Lecturer: Brian Bailey
Brian Bailey is an independent engineering consultant working in the fields of electronic system level (ESL) methodologies and functional verification of embedded systems. He was previously chief technologist for verification at Mentor Graphics, where he pioneered work on hardware/software co-design and co-verification. He is the editor for the EE Times Designlines and a contributing editor to EDN. Embedded systems are the point where hardware and software come together, and this is where Brian Bailey has spent most of his working career, first as a tool developer, then as an architect, and later as a technology writer. He has concentrated on the impact that hardware and software can have on each other and the ways in which this is changing over time into the heterogeneous, concurrent, connected applications of today. He has published seven books, given talks around the world, chairs international standards committees, and sits on the technical advisory board for several EDA companies. He graduated from Brunel University in England with a first class honors degree in electrical and electronic engineering.

Nov. 26, 2012 starting at 9am (Pacific time)
Introduction: Understanding the Connected Factory of the Future and Next-Gen Industrial Apps
In this class, you’ll learn how the flexible, digital factory of the future will dominate the industrial arena, what its components are, and how embedded apps are evolving to serve this new environment.

Nov. 27, 2012 starting at 9am (Pacific)
Part II: Four Pillars of Intelligent Industrial Apps: Security, Manageability, Connectivity and Performance
This lecture will give engineers’ perspective about crossing the bridge from the traditional embedded perspective to intelligent applications, which are more adaptive and responsive to user needs throughout their lifecycle. We’ll define the four pillars of these apps in the context of both engineering requirements and customer benefits.

Nov. 28, 2012 starting at 9am (Pacific)

Part III: Rethinking Embedding Processing: The Bridge to Ivy Bridge
Traditional embedded solutions have drawn from a disparate range of CPU solutions. Emerging, next-gen intelligent apps by definition require a minimum of 32-bits for optimum functionality. We’ll dive into the architecture and features of one such family, the third-generation Intel Core vPro Processors, which include multiple x86-64 cores and embedded security.

Nov. 29, 2012 starting at 9am (Pacific)
Part IV: Apps Development Utilizing the Partner Ecosystem of Intelligent Solution
To help engineers ensure that end-user specs and constraints are factored into the design equation — with the output being a reliable, cost-effective end product — we’ll examine the rich ecosystem of boards, operating systems, security solutions, and tools available for building your intelligent app.

Nov. 30, 2012 starting at 9am (Pacific)
Part V: Case Study: Highlighting a Successful Design Example
Putting it all together is where the rubber meets the road in any embedded effort. We’ll delve into a successful design project, which showcases how engineers at an energy company put to practical use the intelligent concepts discussed in this course to create a noteworthy application.