Overview:
The challenge that many designers face is putting more power into smaller spaces, leading to increased power density and thermal management issues. Listen to this latest webcast to learn about innovative designs from the leading connector manufacturers. Featured presenters will include industry analyst, Bob Hult of Bishop & Associates, Scott Kleinle of FCI, Michael Bean of Molex, and Mike Blanchfield of Tyco Electronics. This free webcast event is sponsored by TTI, Inc. and is part of the company's Technical Seminar Series. So, get empowered and register today!
Moderator:
Lew LaFornara, Vice President of Supplier Marketing, TTI, Inc.
Presenters:
Bob Hult, Industry Analyst, Bishop & Associates, Inc.
Scott Kleinle, Global Products Manager, FCI
Michael Bean, Global Product Manager, Molex, Inc.
Mike Blanchfield, Global Product Manager, Tyco Electronics
 LEW LAFORNARA, VICE PRESIDENT OF SUPPLIER MARKETING, TTI, INC.
Lew is Vice President of Supplier Marketing at TTI. He has more than 28 years experience in the electronic components industry working on both the manufacturing and component distribution sides of the business. While working for Amphenol Aerospace in the military/aerospace market and for FCI/Berg Electronics in the commercial connector market, LaFornara spent the majority of his career managing the distribution channel both domestically and globally.
Prior to joining TTI, he was Vice President of Interconnect at Future Electronics and has experience with Avnet's Hamilton/Hallmark Electronics unit. In addition to his work experience he has served on the Board of Directors of NEDA, as well as on the Board of the NEDA Education Foundation.
 BOB HULT, INDUSTRY ANALYST, BISHOP & ASSOCIATES, INC.
Bob has been in the connector industry for more than 36 years. Starting as a sales engineer with Amphenol in 1968, he joined AMP, Inc. in 1972 and held a variety of positions including district product manager, manager regional new product specialists, advanced packaging products manager, district sales manager, and manager field applications / manpower development. In 1997 he joined Foxconn as group marketing manager. He has been a contributing member of the Bishop & Associates team since 2002.
Bishop & Associates provides specialized services including, custom market research, multiple client studies, surveys, merger and acquisition assistance, and executive recruiting. Bob is TTI's resident industry expert analyst.
 SCOTT KLEINLE, GLOBAL PRODUCTS MANAGER, FCI
Scott is currently the Global Director of Power Products for FCI ELX Division located in Harrisburg, Pa. Scott has been in the electronics industry for 15 years, working the last 11 years for FCI/Berg. During Scott's tenure at FCI/Berg he has served in numerous product, business and market development roles typically focused on FCI's technology products. Scott holds a degree in electrical engineering as well as an MBA from Penn State.
 MICHAEL BEAN, GLOBAL PRODUCT MANAGER, MOLEX, INC.
is a Global Product Manager for high current power products at Molex, Inc. He has been with Molex for 16 years and is a 26-year connector industry veteran in various sales, marketing, industry, and product positions. Currently, Michael is responsible for many of the new power products being released by Molex into the market place.
 MIKE BLANCHFIELD, GLOBAL PRODUCT MANAGER, TYCO ELECTRONICS
Mike is a Global Product Manager for Power Connectors for Tyco Electronics' Communications, Computer and Consumer Electronics Business Unit. Mike has been involved in the development and commercialization of power connectors for both industrial and computer/telecom applications for the past 14 years. Prior to that Mike held various sales, marketing, and applications engineering positions for AMP, Inc. Mike has actively participated in the development of industry standards. Mike has a bachelor's degree in mechanical engineering from the University of Delaware.
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