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On-Demand Webinar |
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| Addressing the Design Challenges of High Definition (HD) Audio and Other Consumer Applications with a 32-bit DSP Engine |
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Overview:
High-end audio applications such as HD DVDs, Digital TVs, Set-top Boxes and A/V Receivers are becoming an enormous challenge for DSP engines. With next generation HD audio codecs, such as Dolby Digital Plus 7.1 and DTS-HD, and the growing requirement for multi-stream decoding, a mere 16-bit DSP becomes an inadequate solution for these growing processing requirements. In addition, low power and small die size are still mandatory requirements when developing chips for such applications.
To address these design challenges and provide the much needed performance improvements, CEVA has introduced CEVA-TeakLite-III, a new native 32-bit TeakLite-compatible architecture.
In this webinar, you will learn how to address the design challenges of next generation High Definition (HD) Audio applications and other consumer applications such as multi-channel VoIP gateways and low-cost multimode handsets and advanced portable audio devices, using the new CEVA-TeakLite-III DSP. This webinar will reveal the insides of a 32-bit DSP that is both powerful enough to support 4 simultaneous Dolby Digital Plus streams and small enough to fit into any portable embedded solution.
Who Should Attend:
Design engineers, DSP specialists, engineering management and system architects responsible for and/or designing next-generation applications such as:
- HD audio device
- Multi-channel VoIP gateways
- Low-cost multimode wireless baseband (2G/2.5G/3G)
- Advanced portable audio players (PMPs, music phones)
Design engineers, DSP specialists, engineering management and system architects using the CEVA-TeakLite and CEVA-TeakLite-II cores.
Presenter:
Michael Boukaya
Michael Boukaya serves as Director of processor architectures and has 9 years of experience in semiconductor and silicon industry. Prior to this, Mr. Boukaya was appointed as VLSI Project Manager of CEVA DSP cores and subsystem platforms. Previously, Mr. Boukaya was with DSP Group beginning in August 1998 as a VLSI design engineer. Mr. Boukaya holds a B.Sc. in Electrical and Computer Engineering from Technion Institute in Israel and holds several US patents.
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Headquartered in San Jose, California, CEVA is the leading licensor of digital signal processor (DSP) cores, multimedia and storage platforms to leading semiconductor and electronics companies worldwide. CEVA licenses a technology portfolio in the form of intellectual property (IP). This portfolio includes a family of programmable DSP cores, DSP-based subsystems and application-specific platforms including multimedia, audio, Voice over Packet (VoP), Bluetooth, Serial ATA (SATA) and Serial Attached SCSI (SAS).
CEVA DSP cores and platforms are deployed in high volume markets, including wireless handsets (e.g. cellular baseband, multimedia solutions and Bluetooth), portable multimedia (e.g. portable video players and portable audio players), home entertainment (e.g. DVD and high definition audio), storage markets (e.g. hard disk drives) and serial communications markets (e.g. high-speed serial storage solutions).
Today CEVA technologies are widely licensed and power some of the world's leading wireless and consumer electronics brands, including Atmel, Broadcom, Chipnuts, Freescale, Fujitsu, Hitachi, Infineon, Marvell, National Semiconductor, NXP, Oki, Renesas, ROHM, Samsung, Sharp, Sony, Spreadtrum, STMicroelectronics, Thomson and Zoran. CEVA-powered chips shipped to date exceed 1 billion, and in 2006, CEVA licensees shipped over 200 million CEVA-powered chips, an increase of 45% over 2005 shipments of 131 million units.
CEVA has almost 200 employees worldwide, with research and development facilities in Israel, Ireland and the United Kingdom, and sales and support offices in Hong Kong, China, Taiwan, Korea, Japan, Sweden, Israel and the United States. CEVA is traded on both the NASDAQ (CEVA) and London Stock Exchange (CVA). |
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