Overview:
The push to address the need for ultra-low-cost handsets (ULCHs) for the developing world has semiconductor manufacturers now facing up to the reality that they can no longer avoid implementing what was once thought impossible to do effectively: integrate the RF with the baseband processing on a single die. Though once unheard of, there are now at least implementations on the market and more are sure to follow given the drive to get to sub-$40 and even sub $20 handsets.
Earlier this year, Infineon put its stake in the single-chip phone market with the announcement of the PMB7870 E-GOLDradio, RF/baseband single-die combo. Based on a mature 130-nm process the device cuts space by more than 50 percent versus two chips and has a die efficiency of 90 percent. As such, the chip is set to help address the needs of the 'other billions' in the developing world looking for the most economical of phones for that killer application: voice.
View this On-Demand seminar to find out how Infineon achieved what was once deemed unachievable.
Use the seminar to see:
- The general structure of the E-GOLDradio and its parameters.
- A breakdown of the various chips in the E-GOLD family.
- A photo of the die outlining its various sections.
- SEM and TEM cross-section photos and descriptions of the chip's advanced process features.
- And much more!
Who should attend:
Designers of SoCs for wireless communications that are looking for the insight into leading-edge design and process technologies and their characteristics.
Presenter:
Michael Keller
Michael Keller is product technical manager for RF at Semiconductor Insights (www.semiconductor.com).
|
