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| Under the Hood Seminar: Micron taps copper metallization for DDR2 DRAM |
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The commodity DRAM industry is ruthlessly competitive, with razor thin margins, relentless downward pressure on prices and billion dollar bets on new fabrication facilities. Because of that competition, risk taking and revolutionary technology changes are not encouraged and so the DRAM industry has taken a pass on other, now mainstream process changes.
Until recently, copper metallization, popular in advanced processor designs from IBM, AMD and Intel, could also have been included in the list of advanced technologies that had failed to find a foothold in the DRAM world, but no longer.
Rumors of the advent of copper for commodity DRAM metallization have circulated in the industry for some time and Semiconductor Insights (SI) has now identified copper metallization devices are in volume production at major DRAM vendor, Micron.
Use this On-Demand seminar to find out how the company, already known for its all-or-nothing approach to innovation, tackled the issues associated with working with copper metallization and how its 512Mbit DDR2 stands up to the competition.
Use the seminar to see:
- What circuit innovations Micron implemented.
- How it overcame the wirebonding issues.
- SEM and TEM photos of the die cross-section.
- A comparison of aluminum versus copper
- And much more!
Who should attend:
IC designers, in particular memory developers, working with advanced processes looking for the latest in process innovation.
Presenter:
Don Scansen
Don Scansen (dons@semiconductor.com) is the lead technology analyst for process technologies at Semiconductor Insights (www.semiconductor.com
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