Overview:
Combined with its execute-in-place capability, the rising density of NOR flash is giving it the edge over NAND flash in the increasingly competitive mobile flash arena, particularly in wireless and automotive. This competition has spurred rapid innovation as the leading NOR vendors—Spansion, Intel and STMicroelectronics—seek greater market shares.
Much of the focus is on increasing density to meet ever-expanding storage requirements for data, audio and video and to reduce overall costs. To that end, Intel was the first to come in at 65 nm with its StrataFlash Cellular Memory, built using its ETOX X 65-nm process. While Spansion has not migrated to a 65nm lithography yet, it has reached comparable density at 90 nm technology and is also moving to QuadBit designs with four bits per cell. The latest entrant is from STMicroelectronics. With a second company entering the 65nm node, it gives OEMs more options. Compared to other devices analyzed, the ST part has the smallest die size resulting in the highest density.
This On-Demand seminar examines the performance characteristics and features of this latest round of NOR flash offerings. Use this seminar to find out:
- What innovative processes were employed by each vendor.
- How each design stacks up to the demands of embedded and mobile applications.
- How each implementation compares with the competition in terms of density and die size.
- Who to bet on for your next design.
- What's next for NOR flash
- And much more…
Who should attend:
Designers and users of embedded and mobile systems, particularly for automotive and wireless.
Presenter:
Gregory A. Quirk
Gregory A. Quirk is technical marketing manager at Semiconductor Insights
(www.semiconductor.com) and can be contacted at gquirk@semiconductor.com.
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