DESCRIPTION
Parts and pitch get smaller. Pin counts get larger. Design cycles get shorter. BGA, MicroBGA, QFN, DQFN, CSP packages are taking the design world by storm. Learn how to avoid the most common trip-ups when designing with these packages. Also learn how the various board finishes can impact the use of advanced package components in a prototype world.

PREREQUISITES
None

ESTIMATED TIME
15 Minutes

AUTHOR

Since 1980, as a Product Manager for companies such as Metheus and In Focus Systems, Benson has had prototype assembly experience ranging from solderless proto boards and wire wrap to hand soldering surface mount parts to fully-automated machine assembly.