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Physical Issues Affecting Die Yield
TSMC and Mentor Graphics
Module
Course
 
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DESCRIPTION
Producing chips with a high yield throughput is a financial goal for every design team. There are a number of issues that can have a detrimental affect on the final water yield. By gaining a deeper insight into the physical issues affecting manufacturability, design teams may be able to incorporate new practices that can improve their overall yield. This session will highlight three of the issues which can effect yield:

  • antenna affects
  • planarity and density affects
  • metalization affects including electro-migration
You will learn the physics that cause these yield issues, how to identify them and what options are available to correct the problems once they have been identified.

PREREQUISITES
None

 

INTENDED AUDIENCE
The audience should be technical and familiar with circuit design and manufacturability.

 

ESTIMATED TIME
40 min.

AUTHOR

TSMC and Mentor Graphics
Mentor Graphics Corporation is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world's most successful electronics and semiconductor companies.

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry industry's largest portfolio of process-proven library, IP, design tools and reference flows.
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Mentor Graphics
TSMC (Taiwan Semiconductor Manufacturing Company)