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M-LVDS: A New Standard for High-Speed Multipoint
Jim Dietz
Module
M-LVDS Tutorial
 
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DESCRIPTION
The demand for moving more data, faster and with less power, is pervasive throughout the electronics industry. The telecommunications and data communications expansion drives the speed of today's communications devices, while component density, reliability concerns, and operational availability necessitate decreased power dissipation. The simultaneous demands to switch faster and consume less power generally lead to multiple design solutions. Designers need new interface technologies to answer today's challenges.

PREREQUISITES
None

 

INTENDED AUDIENCE
Design engineers interested in multipoint topologies.

 

ESTIMATED TIME
30 min.

AUTHOR

Jim Dietz
Jim Dietz is currently responsible for Texas Instruments' new product development in the area of LVDS interface circuits. He has 18+ years experience at Texas Instruments and Raytheon in the area of systems engineering.
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