Overview:
As data rates for high-speed Digital serial links has increased, the ability to portray waveforms at the location engineers desire is impeded because of high frequency artifacts due to probing, cabling, or fixturing. New hardware and software technology on real time oscilloscopes solves this problem by incorporating models of these system elements. This presentation will show various engineering use cases and before and after results of waveform transformation.
Duration: One hour
Who Should Attend:
Signal Integrity engineers, or Engineers of digital ICs or integrated assemblies characterizing or testing designs that want the best representation of their signals.
Giveaway:
Registrants who completely fill out the feedback form by August 28, 2009 will be eligible to win one of two $75 Amazon.com gift certificates. Drawing only open to residents of the 50 United States and Canada (except Quebec). Official Rules
Presenter:
 Brian Fetz, Product Manager, Agilent Technologies
Brian holds a BS in Electrical Engineering from California Polytechnic State University at San Luis Obispo, and a MSEE from the University of Idaho. Brian joined Hewlett Packard/ Agilent in 1983 as a manufacturing engineer and worked as a test engineer and test architect for the RF product lines for Agilent's Base Station and Mobile test products. Before his current position, Brian worked on Agilent's Bluetooth and Signal Integrity solutions.
Brian is currently a product manager overseeing the Digital Display interface market in the high performance oscilloscope product line of the Digital Test Division of Agilent Technologies business based in Colorado Springs, Colorado. Outside of work, Brian is married with two children and enjoys bike riding, basketball and golf.
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