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	Title		Author/Company		Published
	Leveraging Standard IC Packaging for MEMS Oscillators		Pavan Gupta et al SiTime		Jan 2009 White Paper
	MEMS Resonators: Getting the Packaging Right		Aaron Partridge et al SiTime		Jan 2009 White Paper


		Most Popular Technical Papers
		1. Beyond Physical: Solving High-end FPGA Design Challenges 2. Create an Inverting Power Supply From a Step-Down Regulator 3. TI's New LED Reference Design Cookbook 4. Integration Creates Compact CDMA RF Front End with GPS Capability 5. Getting Started with Android Development for Embedded Systems MORE MOST POPULAR TECHNICAL PAPERS


		Highest Rated Technical Papers
		1. Create an Inverting Power Supply From a Step-Down Regulator 2. Isolated Supply Overview and Design Trade-Offs 3. Data Management for Hardware Design Teams 4. Improve Instrument Amplifier Performance with X2Y Optimized Input Filter 5. Energy Efficiency and Reliability in Automatic Transmission Systems MORE HIGHEST RATED TECHNICAL PAPERS



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