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Thermal Derating Curves for Logic-Products Packages

Click to Download	Application Note 71 KB (11 pages) May 2009

Doug Romm and Jeffrey D. Pfeifle Texas Instruments This application notes covers users' need to know the thermal performance of IC packages to be used in their end equipment. Knowing the thermal performance of the IC package for a given device allows the system designer to determine the maximum power that the package can handle.

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Texas Instruments


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