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Implementing DDR2/mDDR PCB Layout on the TMS320DM335 DMSoC

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Application Report
156 KB (15 pages)
August 2008
 

Texas Instruments

This application report contains implementation instructions for the DDR2/mDDR interface contained on the TMS320DM335 Digital Media System-on-Chip (DMSoC) device. The previous approach specified device timing in terms of data sheet specifications and simulation models. The system designer was required to obtain compatible memory devices, as well as the device-specific data sheets and simulation models. This information would then be used to design the printed circuit board (PCB) using high-speed simulation to close system timing.

For the DM335 DDR2/mDDR interface, the approach is to specify compatible DDR2/mDDR devices and provide the PCB routing rule solution directly. TI has performed the simulation and system design work to ensure DDR2/mDDR interface timings are met.

 
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