Phil Stokoe et al.
Amphenol TCS

With recent gains by semi-conductor manufacturers resulting in the widespread availability of devices capable of driving high-speed signals over longer printed circuit board (PCB) traces, system designers are presently considering product designs that have data rates up to 25 Gb/s. This requirement challenges the physical capabilities of further compliant pin miniaturization.

This paper describes a significant advancement in the development of surface mount backplane connectors that meet industry standards of reliability and reparability. The connector has a board footprint and via structure that can meet the electrical performance needed to satisfy future system requirements.