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Thermal Modeling for Application of High Power LED

Click to Download	White Paper 245 KB (5 pages) November 2006

Oon Siang Ling Avago Technologies This paper presents work done to create a high power LED package on MCPCB with heat sink and double layer FR4 with heat sink. First, a detailed model of an LED package-on-substrate is created, then a heat sink is created on the bottom of the LED package. Finally, this simulation data is compared to experimental data.

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Avago Technologies


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