Ravi Mahajan, Raj Nair, Vijay Wakharkar, Johanna Swan, John Tang, and Gilroy Vandentop
Intel, Technology and Manufacturing Group

The continual increasing performance of microelectronics product places a high demand on packaging technologies. Key drivers such as thermal management, power delivery, interconnect density, and integration require novel material development and new package architectures. In this technical paper, package technology migrations for microprocessor and communication product are described. Material needs for high thermal dissipation, high-speed signaling, and high-density interconnects are discussed.