CMP - United Business Media TechOnline
All Articles Products Courses Papers VirtuaLabs Webinars Web



 
LoginRegister
      TechOnline > Electronics Company Directory > Toshiba America Electronic Components (TAEC)

Electronics Company Directory

Toshiba America Electronic Components (TAEC)
indicator A TechOnline Member Company

Simplifying Embedded MLC NAND Designs — This webinar will introduce Toshiba's single-package embedded memory solutions. By combining MLC NAND with an SD, HS-MMC or NAND controller, designers can realize the benefits of MLC NAND while minimizing costs and time to market. Register now.

 
Recent Additions

The Use of EUV Lithography to Produce Demonstration Devices
Technical Paper
Mentor Graphics Technical Library
In this paper, we describe the integration of Ultra Violet (EUV) lithography into a standard semiconductor manufacturing flow to produce demonstration devices. 45 nm logic test chips with functional transistors were fabricated using EUV lithography to pattern the first interconnect level (metal 1).

Toshiba 56nm 16Gb NAND Flash (TC58NVG4D1DTG00) Overview
Technical Paper
Insight Report
This insight report describes Toshiba's next generation of their multi-level cell (MLC) technology NAND Flash devices. These devices offer both the most advanced process and highest single chip density.

Cell processor HD codec debuts
Design Article
Toshiba's H.264 / MPEG-2 video processor uses Cell's Synergistic Processing Element cores.

Advanced Photorelays Prove 'Less is More' in Component Design
Technical Paper
White Paper
This white paper discusses how use of photorelays instead of mechanical relays can help design engineers develop systems with lower power consumption, less heat, and longer life.


Simplifying Embedded MLC NAND Designs
On-Demand Webinar
Sep 19, 2007 • 60 min.
Smaller process geometries and Flash manufacturers' proprietary features have made the integration of MLC NAND more complex. To ease the integration process, Toshiba has developed single-package memory solutions that combine high-density MLC NAND with an SD, HS-MMC or NAND controller to address wear-leveling, block management, and ECC internally. These solutions can be easily used with off-the-shelf system controllers or DSPs, enabling designers to realize the cost/performance benefits of MLC NAND while minimizing development costs and time to market.
 
Toshiba America Electronic Components (TAEC)
Address:
Global Headquarters:
19900 MacArthur Blvd.
Ste. 400
Irvine, CA 92612
USA
Phone: 949-623-2900
Fax: 949-474-1330
http://www.toshiba.com/t
aec/
Contact Info:
Sales Contact
Phone: 949-623-2900
Related Links
companydescription Company Description
ondemandwebcasts On-Demand Webinars
courses Courses
technicalpapers Technical Papers
Design Articles Design Articles

Toshiba's Introduction to Flash Memory Tutorial:

This presentation addresses the development and evolution of flash memory and how this low-cost, solid-state storage technology has enabled new markets.