Pyxis Technology and Silicon Canvas Show Integration
Design Article
Companies demonstrate the use of the OpenAccess Run-Time-Model (OA-RTM) to enable the simultaneous execution of two commercial tools within the same Unix process.
Design for Manufacturing is Everyone's Business
Design Article
To be a viable volume-production item, a chip must exhibit sufficient yield throughout the manufacturing chain, including fabrication, packaging and test. Just as chip designers must design their products such that they can be successfully tested, they must also take into consideration factors that will maximize the chip's yield after all the relevant manufacturing operations. In this feature article, Jim Lipman discusses design for manufacturing (DFM).
Design for Manufacturability Solution Using OpenAccess
Technical Paper
OpenAccess Conference Paper The industry-leading technologies and services from PDF Solutions can help semiconductor companies achieve improved profitability. It does this by enabling them to create IC designs that are more easily manufactured, and manufacturing processes that are more capable. As the semiconductor industry moves into nanometer processes, the role of designers in yield-driven profitability becomes critical. To aide designers, PDF is bringing process-aware products and IP solutions to the DFM realm.
Getting to Silicon Through OpenAccess
Technical Paper
OpenAccess Conference Paper During the past 18 months Arrowsmith Research has co-developed the foundation for LSI Logic's RapidWorx design software using the OpenAccess database. This has been a program associated with their RapidChip program. RapidChip has been described as both a platform ASIC and as a structured ASIC. One of the fundamental concepts of RapidChip is the creation of pre-built Slices containing power and ground nets as well as aggregations of proven IP. Arrowsmith Research and LSI Logic describe their results of using OpenAccess in taping out 130 nm silicon.
OpenAccess for LSI Logic Chip Packaging Automation
Technical Paper
OpenAccess Conference Paper LSI Logic uses proprietary chip packaging tools for ASIC and Platform ASIC designs. This paper describes the use of OpenAccess as the centralized database model in the development of LSI Logic's chip packaging tool referred to as Bond. The OA database structure is discussed in reference to its modular approach to tool development. Owing to specific requirements in the area of packaging, it has been necessary to leverage its various database extension mechanisms. Examples and experiences of using these extensions are presented.
