Finding Elusive problems in High Speed Serial Data Links
Join Teledyne LeCroy as we discuss the measurement challenges engineers face for characterizing high speed serial links as data rates increase beyond 10 Gb/s. We will present measurement tools that are available to engineers for identifying signal integrity challenges for the next generation of serial data standards including PCIe 3.0 and 10 Gb Ethernet.
This webinar will cover practical techniques that can be used to accurately measure and analyze high speed signals within circuits that are often inaccessible using conventional probing techniques or require advanced analysis in order to characterize jitter and BER performance.
For more information on Teledyne LeCroy, please visit us on-line at http://www.teledynelecroy.com.
Howard Williams, Teledyne LeCroy Field Applications Engineer