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Power Module on Single IC: Save Board Space, Reduce Design Time and Lower Costs for your Point of Load Power Supply

Original Air Date: Mar 14, 2013 | Duration: 60 minutes Webinar
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Intersil Power Module Webinar: 3/14

Title: Power Module on Single IC: Save Board Space, Reduce Design Time and Lower Costs for your Point of Load Power Supply

Overview:
If your FPGA, DSP or ASIC designs requires a power solution to deliver high output power, or if you have a critical space constraint in your POL power supply, then please join Tim Lok for a 30 min webinar to learn more about how Intersil's power modules may be a good fit for your system. This webinar will introduce Intersil's highly integrated encapsulated DC-DC power modules, with a strong focus on our newest product, the ISL8225M, which offers the industry's highest output current 30A in a single IC package.

Two lucky attendees of the live webinar will receive a free ISL8225M evaluation board in a random drawing that will be held after the webinar has ended. Click here for official rules.

What registrants will learn:

  • What is a fully encapsulated DC-DC module
  • How Intersil power modules reduces design time, cost and complexity
  • How optimized thermal packaging allows Intersil power modules to operate over wide temperatures
Presenter:
Tim Lok, Marketing and Business Developer, Power Management Products Group, Intersil
Tim Lok is a marketing and business developer for Intersil Power Management products group focusing on Intersil's power module products. Tim started his career with Intersil six years ago in the Applications Engineering group.




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