Designing to the New PCI Express 3.0 Equalization Requirements

Overview:
PCI Express 3.0 increased the supported data rate to 8 Gbps, which effectively doubles the data rate supported by PCI Express 2.0. While the data rate was increased, no improvement was made to the channels. As such, an 8 Gbps channel in PCIe 3.0 experiences significantly more loss than one implemented in PCIe 2.0. To compensate for this increased loss, PCI Express 3.0 specifies enhanced equalization in the PHY with improved TX equalization, improved RX equalization, and equalization training.

It is critical that designers who plan to implement PCIe 3.0 understand these equalization changes and their impacts. After attending this webinar, registrants will understand:

• Why improved levels of equalization are necessary at higher data rates
• Types of equalization enhancements required for optimal performance at 8 Gbps
• The difference between decision feedback equalization (DFE) and continuous time linear equalization (CTLE)
• The need for equalization training and adaptability in PCIe 3.0
• The importance of proven interoperability between the PHY and the controller

Who should attend: SoC designers and system architects

Duration: 60 minutes

Presenters:
Rita Horner, Senior Technical Marketing Manager for Analog/Mixed Signal IP, Synopsys
Rita Horner has more than 20 years' experience in mixed-signal circuit design, interconnect, test, and packaging of high-speed integrated circuits for consumer, computing, and high-end networking ASSP and ASIC products. As a technical and product marketing manager, she has experience in ASSP, ASIC and Fiber Optic products, focusing on High Speed Serial Interconnect. She participated and presented in multiple standards bodies including ANSI T11, IEEE 802.3, OIF, and SFF Multi Sourcing Agreements.

David Rennie, Senior Analog Design Engineer for Mixed-Signal Interface IP, Synopsys
David Rennie is a Senior Analog Design Engineer for Synopsys' Mixed-Signal IP, developing next-generation high-speed PCIe and Ethernet SerDes technologies. David has authored and co-authored fifteen IEEE conference and journal papers and holds five granted and three pending patents. He has presented at several industry and IEEE conferences, and is an active member in the IEEE.