Achieve Lower Silicon Cost Using Embedded Memory Test and Repair
Embedded memories are the most dense components within a system-on-chip (SoC), accounting for more than 50 percent of the chip area. Designed using aggressive design rules, embedded memories tend to be more prone to manufacturing defects and field reliability problems than any other core on the chip. In order to achieve lower silicon cost it is critical that embedded memory test and repair solutions provide superior test quality and yield optimization. Additionally, these solutions need to improve design productivity by providing a performance-, power- and area-optimized hierarchical architecture for today's complex designs, along with seamless integration with design implementation flows, to achieve quick design closure and faster time to volume production. In this webinar, we will discuss advanced embedded memory test solution capabilities including hierarchical implementation and validation, fault detection in very deep submicron technologies, repair at the manufacturing level, diagnosis for process improvement and field repair and error correction (ECC) capabilities that address today's design yield and reliability needs.
What you will learn:
- The technical trends and challenges associated with embedded test, repair and diagnostics in today's designs.
- The trade-offs and design impact of various solutions.
- How Synopsys' DesignWare® STAR Memory System® can meet your embedded test, repair and diagnostics needs.
Dr. Yervant Zorian, Chief Architect for embedded test & repair products, Synopsys
Dr. Zorian is the Chief Architect at Synopsys for embedded test & repair products in Mountain View, California.
Formerly, he was Distinguished Member of Technical Staff AT&T Bell Laboratories, Vice President and Chief Scientist of Virage Logic and Chief Technologist at LogicVision. He received an MS degree in Computer Engineering from University of Southern California, a PhD in Electrical Engineering from McGill University, and an MBA from Wharton School of Business, University of Pennsylvania.
He is currently the President of IEEE Test Technology Technical Council (TTTC), General Chair of Design Automation Conference (DAC), the Editor-in-Chief Emeritus of Design & Test of Computers, the founder & chair of IEEE 1500 Standardization Working Group, and an Adjunct Professor at University of British Columbia.