On-Chip ESD Protection in Complex Analog/Mixed-Signal and High-Voltage Designs
Electrostatic discharge (ESD) is a serious threat to integrated circuits (ICs) that can cause irreversible damage. Please join X-FAB for a free webinar on ESD protection to learn how to eliminate ESD threats in complex analog/mixed-signal and high-voltage designs.
This webinar presents an overview of various ESD protection concepts, and explains the structures and schemes available to protect against electrostatic discharge in X-FAB’s enhanced 0.35 and 0.18 micrometer XH035 and XH018 high-voltage foundry processes. It examines behavior, layout and application requirements. It also highlights similarities and differences among ESD protection concepts, outlining the advantages and disadvantages of each in circuit designs.
Lars Bergmann, Design Support Engineer, X-FAB Semiconductor Foundries
Lars Bergman is working in the field of electrostatic discharge (ESD) and ESD protection on circuit-level since 2006. The main focus of his work is the development and ESD characterization of protection structures and IO-Cells in X-FAB's technology feature sizes from 0.13 µm to 1.0 µm.
Lars holds a diploma degree in Electrical Engineering focusing on microelectronics from the University of Applied Sciences Schmalkalden, Germany.