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New Specifications Deliver Ultra-Fast Performance and Lower Power Consumption for Mobile Devices

Original Air Date: Mar 30, 2011 | Duration: 60 min Webinar
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Overview:
Ever-increasing consumer expectations for mobile device performance and functionality are driving a need for targeted interface and storage solutions, high data transfer speeds and advanced power management.

MIPI® Alliance's M-PHY and UniProSM specifications are optimized for mobile applications, and are designed from the ground up for efficient power management in mobile devices, including enabling efficient transitions between the active and power save modes. The M-PHY interface is designed as the primary physical interface (PHY layer) for the UniPro specification, and is a high speed serial interface targeting up to 2.9 gigabits per second (Gbps) per lane with up-scalability to 5.8Gbps per lane.

JEDEC's Universal Flash Storage is a next-generation storage system standard for both embedded and removable flash memory-base storage in mobile devices, and is specifically tailored for applications and computing systems requiring high performance and low power consumption. UFS targets the highest performance and most power efficient data transport through use of the M-PHY and UniPro specifications to form its Interconnect Layer.

Why You Should Attend:

  • Hear from technical experts directly involved in the development of M-PHY, UniPro and UFS
  • Learn the key features of UniPro, M-PHY and UFS
  • Discover how these power and performance benefits can improve your next product design

Presenters:
Dirk Uffmann, Architect for Mobile Memory, Research in Motion
Chair of the MIPI® Alliance Technical Steering Group 

Hung Vuong, System Architect, Qualcomm
Co-Chair, JEDEC's JC-64.1 Subcommittee for Electrical Specifications and Command Protocols 

Additional speakers:
Miika Rummukainen, Senior Technology Manager, Nokia 

Victor Tsai, NAND Architecture Strategy, Micron Technology

Ken Drottar, Intel 

Sung H. Lee, Sr. Engineer of Memory Product Planning & Application Engineering Team, Samsung Semiconductor

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Sakke Posted Mar 30, 2011

There was no way to join the webinar.

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