Design Con 2015
Welcome Guest Log In | Register

Mil/Aero Thermal Management

Authored on: Nov 1, 2013 by Brian Hoden

Technical Paper

0 0
More InfoLess Info
The latest generation of processors, GPUs, switch fabrics, and memory has placed more computing power into the hands of the designer. The improved performance has come with the challenge of higher power and higher power density for the designer to manage. This white paper will discuss the thermal challenges, as well as explore the next generation thermal solutions available to maximize the performance for applications.
View
 
0 comments
write a comment

Please Login

You will be redirected to the login page

×

Please Login

You will be redirected to the login page

×

Please Login

You will be redirected to the login page