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Five Emerging DRAM Interfaces You Should Know for Your Next Design

Authored on: Aug 1, 2013 by Gopal Raghavan

Technical Paper

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Because dynamic random-access memory (DRAM) has become a commodity product, suppliers are challenged to continue producing these chips in increasingly high volumes while meeting extreme price sensitivities. It's no easy feat, considering the ongoing demands for increased bandwidth, low power consumption, and small footprints from a variety of applications. This white paper takes a look at five next-generation DRAM technologies—LPDDR3, LPDDR4, Wide I/O 2, HBM, and HMC—that address these challenges.
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