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Solving the problem of diminishing test coverage from in-circuit test (ICT)

Authored on: Jan 2, 2013 by Adam Ley

Technical Paper

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This paper explains why test coverage from intrusive, probe-based in-circuit testers with their bed-of-nails fixtures is diminishing. It also describes software-based non-intrusive methodologies that test from the inside out and eliminate the need to physically probe chips and circuit boards during prototype board bring-up, volume manufacturing and troubleshooting in the field.
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