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Converting to Pin-Gate Molding Process to Meet Industry Low Cost Demand

Authored on: Jan 2, 2012 by Jeff Miks

Technical Paper / Product Paper

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Nearly 75% of the PBGA cost structure is driven by the cost of substrates and Au wire, with the cost split nearly equally between the two. Amkor's pin-gate mold (PGM) process aggressively attacks these 2 specific areas of cost. This paper dives into the reasons why Amkor's PGM process has brought life back into an aging product.
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