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Ultra-Low & Low Profile Spring Pins

Authored on: Jun 29, 2012

Technical Paper / Application Note

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Mill-Max has developed a series of ultra-low and low profile spring pins for applications where above board height is limited. As packaging requirements for electronics continue to shrink in size, traditional interconnects don’t always fit the bill. For board-to-board or device-to-board connections, low profile spring pins are a practical solution.
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