Aspect Ratio Driven Floorplan for IR Drop and Die Size Reduction
More InfoLess Info
A technique to improve the voltage drop and die size by correctly specifying the aspect ratio of a die is being proposed. The approach establishes a relationship between the metal directions and the aspect ratio of the die design and proposes the direction in which the aspect ratio of a die should be chosen (< 1 or > 1) so that the die level voltage drop and its distribution improves. If the metal flow direction and the respective resistivity of the metal layers is used as one of the determinants of the eventual aspect ratio of the die, the voltage drop and its distribution is improved and consequently, the die size can be reduced.
Please disable any pop-up blockers for proper viewing of this paper.