Design Con 2015
Welcome Guest Log In | Register

Odd-Form Factor Package Wire Bond Case Studies

Authored on: Nov 1, 2009 by Daniel Evans

Technical Paper / Case Study

0 0
More InfoLess Info
Although there is continued effort in the semiconductor packaging industry to reduce package size along with the never ending pursuit of cost savings, there remain a significant number of applications which require a wildly different set of capabilities for wire bonding. This paper will explore the wire bonding requirements of several device cases that could be considered odd form factor package formats when compared to mainstream semiconductor packaging. Example cases are presented to show the challenges and solutions to wire bond packages in the RF, Automotive, and Optical markets with large form factor (12inch x 6inch), deep reach (0.535 inch), leads, pins, and other challenges.
View
 
0 comments
write a comment

Please Login

You will be redirected to the login page

×

Please Login

You will be redirected to the login page

×

Please Login

You will be redirected to the login page