datasheets.com EBN.com EDN.com EETimes.com Embedded.com PlanetAnalog.com TechOnline.com  
Events
UBM Tech
UBM Tech
Welcome Guest Log In | Register | Benefits

Micron Level Placement Accuracy Case Studies for Optoelectronic Products

Authored on: May 11, 2009 by Daniel Evans, Zeger Bok

Technical Paper / Case Study

0 0
More InfoLess Info
Applications requiring ultra high placement accuracies of 1um to 3um are resurfacing in several optoelectronic applications such as Arrayed Laser Print Head assemblies, P-Side Down Laser Attachment applications, and Multi-Channel Optical Communication products. An overview of the technologies, placement accuracies, and attachment methods is presented for two cases. With placement accuracies for surface mount machines typically around 40µm, 10µm for die attach machines, and 1µm for ultra high accuracy placement machines, this paper will cover the differences in measurement, material, and process controls that are required to successfully achieve ultra high placement accuracies of 3µm.
0 comments
write a comment

Please Login

You will be redirected to the login page

×

Please Login

You will be redirected to the login page

×

Please Login

You will be redirected to the login page