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Improved Bond reliability through the use of Auxiliary Wires (Security Bumps and Stand-Off Stitch)

Authored on: Nov 1, 2010 by David Rasmussen, Rodney Thompson

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Whether the need is due to poorly bondable materials, non-flat bonding surfaces, odd packaging situations, or just the need for high reliability; the integrity of a wire bond interconnect can usually be greatly improved through the proper use of Auxiliary Wires. Auxiliary Wires are defined as Security Wires, Security Bumps, or Stand-Off Stitch (aka Stitch on Bump).
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