Improved Bond reliability through the use of Auxiliary Wires (Security Bumps and Stand-Off Stitch)
More InfoLess Info
Whether the need is due to poorly bondable materials, non-flat bonding surfaces, odd packaging situations, or just the need for high reliability; the integrity of a wire bond interconnect can usually be greatly improved through the proper use of Auxiliary Wires. Auxiliary Wires are defined as Security Wires, Security Bumps, or Stand-Off Stitch (aka Stitch on Bump).
Please disable any pop-up blockers for proper viewing of this paper.