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3D IC Development Needs Innovative Socket Solution

Authored on: Jun 1, 2010 by Ila Pal

Technical Paper

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Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions. 3-D packaging can be achieved via die stacking in one package, package-in-package stacking or package on package stacking. Each method has its pros and cons. Read this paper to learn more.
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