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The Five Pitfalls of 4G Baseband SoC Design

Authored on: Oct 25, 2010 by Chris Rowen

Technical Paper

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High-volume, optimized silicon forms the heart of all the latest 4G and LTE equipment designs including cell phones, data cards, and other high-end mobile wireless products. Making 4G work is a tough design problem. This white paper is based on Tensilica's experiences with designing building blocks for LTE PHY designs—including the DSPs and forward-error correction subsystems—and complete LTE baseband systems. These experiences have revealed five key pitfalls associated with LTE baseband development. This white paper shows how to recognize and avoid those pitfalls.
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