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Five Via-in-Pad Myths

Authored on: Jun 23, 2010 by Duane Benson

Technical Paper

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This paper evaluates common misconceptions about the use of via-in-pad as a viable design technique. It takes the perspective that via-in-pad is a design tool that can be used correctly or incorrectly, and shows examples of both good and bad design.

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BWatson Posted Jul 28, 2010

Even though I started laying out boards when tape and mylar was the in vogue, I have not been exposed to the term "via-in-pad." So the paper would have meant more to me if it began by defining the topic. Sincerely, Bob Watson, N.C.E. Southern Technologies Corp

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Sensorguy_0623 Posted Jul 28, 2010

Good article. Via-in-pad solutions will increase the cost of the board. In many cases, the ability to reduce the size of the board because of the higher density could make cost a wash since if you are forced to use the techniques for the BGA, carrying it across to other components comes at minimal cost.

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Davepcb Posted Aug 25, 2010

The technology is not new, it has been around for 15+ years but not common for the PCB fab houses. As parts get smaller and the fab houses get the via fill technology standardized it will be necessary to use these once advanced techniques to get boards done at all. It may reduce size and layers using this technique and designing using 4 mil line space.

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DHambley Posted Aug 27, 2010

Cooties?? OMG, help! Noooooooooo

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charly5139 Posted Sep 29, 2010

With 0.4mm pitch, it's still possible to have ONE trace routed between the zig-zag balls if you use 3mil traces. I strongly agree to use "closed" vias only.

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